معاني لاختصارات شائعه

[burai nuraldaem]

Device Families:

TTL (74xx) True TTL
74L Low power
74S Schottky
74H High speed
74LS Low power - Schottky
74AS Advanced - Schottky
74ALS Advanced - Low power - Schottky
74F(AST) Fast - (Advanced - Schottky)
74C CMOS...................check Vcc levels
74HC (U) High speed - CMOS (Unbuffered output)
74HCT High speed - CMOS - TTL inputs
74AHC Advanced - High speed - CMOS
74AHCT Advanced - High speed - CMOS - TTL inputs
74FCT (-A) Fast - CMOS - TTL inputs (speed variations)
74FCT (-T, -AT) Fast - CMOS - TTL inputs (speed variations)
74AC Advanced - CMOS
74ACT Advanced - CMOS - TTL inputs
74FACT AC, ACT (Q) series
74ACQ Advanced - CMOS - Quiet outputs
74ACTQ Advanced - CMOS - TTL inputs - Quiet outputs

Bus Driver Families

74ABT Advanced - BiCMOS - Technology
74ABTE ABT - Enhanced Transceiver Logic
74ABTH Advanced - BiCMOS - Technology - bus Hold
74BCT BiCMOS - TTL inputs
74BTL Backplane - Transceiver - Logic
74GTL Gunning - Transceiver - Logic
74GTLP GTL Plus

Low Voltage Families

74ALB Advanced - Low Voltage - BiCMOS
74LV (U) Low - Voltage (Unbuffered output)
74LVC (R) (U) LV - CMOS (damping Resistor)(Unbuffered output)
74LVCH Low - Voltage - CMOS - bus Hold
74ALVC Advanced - Low - Voltage - CMOS
74LVT (R) (U) LV - TTL (damping Resistor(Unbuffered output)
74LVTZ Low - Voltage - TTL - High Impedance power-up
74ALVC (R) ALV - CMOS (bus Hold) (damping Resistor)
74ALVCH Advanced - Low - Voltage - CMOS - bus Hold
74LCX LV - CMOS (operates with 3v & 5v supplies)
74VCX LV - CMOS (operates with 1.8v & 3.6v supplies

[burai nuraldaem]

ECL Device Families:

MEC I = 8nS*
MEC II = 2nS*
MEC III = (16XX) 1nS* .......* = Rise & Fall Times
101xx = 100 series 10K ECL, 3.5nS*
102xx = 200 series 10K ECL, 2.5nS*
108xx = 800 series 10K ECL, voltage compensated, 3.5nS*
10Hxxx = 10K - High speed, voltage compensated, 1.8nS*
10Exxx = 10K - ECLinPS, voltage compensated, 800pS*
100xxx = 100K, temperature compensated
100Hxxx = 100K - High speed, temperature compensated
100Exxx = 100K - ECLinPS, temp, voltage comp., 800pS*

انشاء الله ادرج اخري في قادم المشاركات

[burai nuraldaem]

Abbreviations in Electrical & Electronics Engineering

16QAM (16-state quadrature amplitude modulation
64QAM (64-state quadrature amplitude modulation
8DPSK (8-state differential phase shift keying
A (Ampere, Amp
A/D (Analog to Digital
AC (Alternating current
AC/DC (Alternating current or direct current
ADC (Analog to digital converter
AES Advanced Encryption Standard
AFC (Automatic Flow Controller
AFC (Automatic Frequency Control
AFT (Automatic fine tuning
AGC (Automatic gain control
AGPS (Assisted (or Aided) GPS
AI (Analog Input
AI (Artificial Intelligence
AIAG (Automotive Industry Action Group
AMOLED (Active-Matrix Organic Light-Emitting Diode
ANSI (the U.S. American National Standards Institute
AO (Analog Output
AoA (Angle of arrival
AOI (Automatic Optical Inspection
AP (Access Point
APFC (Active Power Factor Correction
API (Application Programming Interface
ARM (Advanced Reduced instruction set computing Machine
ASIC (An Application-Specific Integrated Circuit
ASP (Application Service Provider
AT ( AT Attachment
ATAPI (AT Attachment Packet Interface
AV (Audio/video
AVDD (Analog Power


BER (Bit error rate
BGA (Ball Grid Array
BiCMOS (Bidirectional CMOS
BLE (Bluetooth Low Energy
BOM (Bill Of Materials
bps (bit per second
BSM (Body Control Module


CA (Conditional Access
CA (Criticality Analysis
CAD (Computer-Aided Design
CAM (Conditional Access Module
CAN (Controller Area Network
CAPAD (Capacitors Non Polarized Axial Diameter Horizontal Mounting
CAPADV (Capacitors Non Polarized Axial Diameter Vertical Mounting
CAPAE (Capacitor Aluminum Electrolytic
CAPAR (Capacitors Non Polarized Axial Rectangular
CAPARV (Capacitors Non Polarized Axial Rect. Vertical Mounting
CAPC (Capacitor Chip Non-polarized
CAPCAF (Capacitor Chip Array Flat
CAPCAV (Capacitor Chip Array Concave
CAPCP (Capacitor Chip Polarized
CAPCWR (Capacitor Chip Wire Rectangle
CAPM (Capacitor Molded Non-polarized
CAPMP (Capacitor Molded Polarized
CAPPA (Capacitors Polarized Axial Diameter Horizontal Mounting
CAPPRD (Capacitors Polarized Radial Diameter
CAPRB (Capacitors Non Polarized Radial Disk Button Vertical
CAPRD (Capacitors Non Polarized Radial Diameter
CAPRR Capacitors Non Polarized Radial Rectangular Vertica
CAS (Conditional Access System
CBC (Cipher Block Chaining mode
CC (Cable Card
CCIPCA (Candid Covariance Free Incremental Principal Component Analysis
CFP (Ceramic Flat Package
CI (Common Interface protocol
CiA (CAN in Automation, see also CAN
CIS (Component Information System
CLK (Clock
CLKOUT (Clock Output
CM (Multimedia Codec Manager
CMOS (Complementary Metal – Oxide Semiconductor
CMRR (Common Mode Rejection Ratio
COR (Cranking Operative Range
CQFP (Ceramic Quad Flat Packages
CS (Chip Select
CSA (Common Scrambling Algorithm
CSL (Coordinated Sample Listing
CTE (Coefficient of Thermal Expansion
CVBS (Color Video Blanking and Sync


D (Detection
D/A (Digital to Analog
DAC (Digital to Analog Converter
DBS (Dual-band simultaneous
DC (Diagnostic Covearage
DDR (Double Data RAM
DDR (Double Data Rate
DES (Data Encryption Standard
DFHP (Device-Free Human Presence
DFMEA (Design FMEA see FMEA
DFN (Dual Flat No-lead
DI (Digital Input
DIA (DivelopmentInterface Agreement
DIOAD (Diodes Axial Diameter Horizontal
DIOADV (Diodes Axial Diameter Vertical
DIOC (Diode Chip
DIOM (Diode Molded
DIOMELF (Diode metal electrode leadless face melf
DIOSC (Diode Side Concave
DIP (Dual-in-Line Package
DIPS (Dual-In-Line Sockets
DK (Development Kit
DMA (Direct Memory Access
DNC (Do Not Connect
DO (Digital Output
DRAM (Dynamic Random Access Memory
DRBFM (Design Review Based on Failure Mode
DRM (Digital Rights Management
DSL (Digital Subscriber Line
DSP (Digital signal processor
DTCP-IP (Digital Transmission Content Protection over Internet Protocol
DTE (Data Terminal Equipment
DTV (Digital TeleVision
DUT (Device Under Test
DVB (Digital Video Broadcasting
DVB-C (Digital Video Broadcasting – Cable
DVB-S (Digital Video Broadcasting – Satelite
DVB-S2 (Digital Video Broadcasting – Satellie Second Generation
DVB-T (Digital Video Broadcasting – Terrestri
DVB-T2 (Digital Video Broadcasting – Second Generation Terrestrial
DVDD (Digital Power


E/E System (Electrical and/or Electronic System
E2LP (Embedded Engineering Learning Platform
ECAD (Electronic Computer-Aided Design
ECB (Electronic Codebook mode
ECDM (Electronic Component Data Management
ECM (Entitlement Control Management
ECO (Engineering change orders
EDA (Electronic Design Automation
EDC (Error Detection-correction Codes
EDR (Enhanced data rate
EGNOS (European Geostationary Navigation Overlay Service
EIA (Electronic Industries Alliance
Electrolytic Ni /Au (Electrolytic Nickel / Gold
EMI (Electromagnetic interference
EMM (Entitlement Management Message
eMMC (Embedded Multimedia Card
ENIG (Electroless Nickel-Immersion Gold
ENIP (Electroless Nickel-Immersion Palladium
ESCL (Electronic Steering Column Lock
ESD (Electro-Static Discharge
ESL (Equivalent Series Inductance
ESR (Equivalent Series Resistance
ESR (Equivalent Series Resistance
ETH (Ethernet
ETSI (European Telecommunications Standards Institute
EVM (Error Vector Magnitude
EVM (EValuation Module


FIFO (First In First Out
FIT (Failure In Time
FMC (FPGA Mezzanine Card
FMEA (Failure Mode and Effects Analysis
FMEA (Failure Modes and Effects Analysis
FMECA (Failure Mode, Effects and Criticality Analysis
FMEDA (Failure Modes, Effects and Diagnostic Analysis
FMMEA (Failure Modes, Mechanisms and Effect Analysis
FPGA (Field-Programmable Gate Array
FSC (Functional Safety Concept
FTA (Fault Tree Analysis
FTTI (Fault Tolerant Time Interval
FUSM (Fuse Molded


GDOP (Geometric Dilution of Precision
GLONASS (Global Navigation Satellite Syste
GND (Ground
GNSS (Global Navigation Satellite System
GPIO (General Purpose Input Output
GPS (Global Positioning System
GUI (Graphic User Interface


H&R (Hazard Analysis and Risk Assessment
HAL (Hardware Abstraction Layer
HASL (Hot Air Solder Level
HD (High Definition
HDMI (High-Definition Multimedia Interface
HDR (Header
HDRRA (Header Right Angle
HDRV (Header Vertica
HDTV (High Definition TV
HPC (High Pin Count
HS (High Speed
HSDPA (High Speed Downlink Packet Access
HSIC (High Speed Inter Chip
HSUPA (High Speed Uplink Packet Access


I/O (Input Output
I2C (Inter-Integrated Circuit
I2S (Inter-IC Sound
IC (Integrated Cicuit
IDE (Integrated Drive Electronics
IEEE (Institute of Electrical and Electronics Engineers
Imm Ag (Immersion Silver
Imm Sn (Immersion Tin
INDAD (Inductor Axial Diameter Horizontal Mounting
INDADV (Inductor Axial Diameter Vertical Mounting
INDC (Inductor Chip
INDCAF (Inductor Chip Array Flat
INDCAV (Inductor Chip Array Concave
INDM (Inductor Molded
INDP (Inductor Precision Wire Wound
INDRD (Inductors Radial Diameter
IoE (Internet of Everything
IoT (Internet of Things
IP (Intellectual Property
IP (Internet Protocol
IPC (Interconnecting and packaging electronic Circuit
IR (Infra Red
ISO (International Standardization Organization
ISP (Internet service provide


JESD (JEDEC standards
JTAG (Joint Test Action Group
JUMP (Jumper


kbps (kilobits per second
KL (German abbriviation for Klemme, Eng. Contact in the vehicle
KL15 (is position #2 (on) of ignition switch in the vehicle
KL30 (is battery positive contact, connected all the time in the vehicle
KL31 (is battery negative contact, connected all the time in the vehicle
KL50 (is position #3 (start) of ignition switch in the vehicle
KLR (means position #1 (accessory) of ignition switch in the vehicle


LCC (Quad Leadless Ceramic Chip Carrier
LCCS (Quad Leadless Ceramic Chip Carrier
LCD (Liquid-crystal display
LCM (Lighting Connectivity Module
LED (Light-emiting diode
LEDM (LED Molded
LEDSC (LED Side Concave
LFM (Latent Fault Metric
LGA (Land Grid Array
LIN (Local Interconnect Network
LLC (Leadless Chip Carrier
LNA (Low Noise Amplifier
LPC (Low Pin Count
LPCM (Linear pulse-code modulation
LPRF (Low Power RF
LTE (Long-Term Evolution
LTE (Long-Term Evolution
LTI (Lead Tip Inspection


M2M (Machine to Machine
MCAD (Mechanical Computer-Aided Design
MDIO (Management Data Input Output
MIB (Management Information Base
MICTOS (MICronas TV Operating System
MII (Media Indenpendet Interface
MISO (Master Input Slave Output
MMC (MultiMediaCard
MMP (MultiMedia Player
MMU (Memory Management Unit
MOSI (Master Output Slave Input
MPEG (Motion Picture Experts Group
MRDY (Master Ready
MSD (Mass Storage Device
MSD (Moisture sensitive device
MSL (Moisture Sensitivity Level
MTSAT (Multifunctional Transport Satellites


N/A (Not applicable
NA (Network Analyzer
Nagra PRM (Nagra Media Persistent Rights Management
NC (No Connection
NIM (Network Interface Module
NM (Not Mounted
NMEA (National Marine Electronics Association
NPTH (Non Plated Through Hole
NTSC (National Television System Committee


OD (Open Drain
OD (Outside Diameter
ODVA (Open DeviceNet Vendors Association
OEM (Original Equipment Manufacturer
OMAC (One-key Message Authentication Code
OS (Operating System
OSC (Oscillator
OSCCC (Oscillaor Corner Concave
OSCJ (Oscillator J-Lead
OSCL (Oscillator L-Ben Lead
OSCSC (Oscillator Side Concave
OSI (Open Systems Interconnection
OSP (Organic Solderability Preservative
OTG (On-The-Go


P (Probability
PA (Power amplifier
PAD (Process Application Definition
PADS (Personal Automated Design System
PAL (Phase Alternating Line
PAL (Programmable Array Logic
PATA (Parallel ATA
PBL (Primary Boot Load
PCB (Printed Circuit Board
PCMCIA (Personal Computer Memory Card International Association
PDET (Power detector
PES (Project Engineer for Safety
PFH (Probability of dangerous Failure per Hour
PFMEA (Process FMEA see FMEA
PGA (Pin Grid Array
PID (Packet Identifier
PIR (Passive Infrared Sensors
PLCC (Plastic Leaded Chip Carrier
PLCCS (Plastic Leaded Chip Carrier Socket Square
PM (Power management
PMHF (Probabilistic Metric for Random Hardware Failures
PMIC (Power management integrated circuit
PQFN (Pull-back Quad Flat No-lead
PS (Power Supply
PSE (Project Safety Engineer
PSON (Pull-back Small Outline No-lead
PTH (Plated Through Hole
PVR (Personal video recorder
PWM (Pulse Width Modulation
PWR (Power


QFN (Quad Flat No-lead
QFP (Quad Flat Package
QZSS (Quasi-Zenith Satellite Syste


RAM (Random-Access Memory
RAM (Read-Only Memory
RCA (Radio Corporation of America
RCF (Relative Centrifugal Force
RDBS (Radio Broadcast Data System
RDS (Radio Data System
RESAD (Resistor Axial Diameter Horizontal Mounting
RESADV (Resistor Axial Diameter Vertical Mounting
RESAR (Resistor Axial Rectangular Horizontal Mounting
RESC (Resistor Chip
RESCAF (Resistor Chip Array Flat
RESCAXE (Resistor Chip Array Convex E-Version _Even Pin Size
RESCAXS (Resistor Chip Array Convex S-Version -Side Pins Diff
RESM (Resistor Molded
RESMELF (Resistor MELF
RFI (Radio Frequency Interference
RGMII (Reduced Gigabit Ethernet Media Independent Interface
RH (Relative humidity
RHFT (Random Hardware Failure Target values
RISC (Reduced Instruction Set Computer
RoHS (Restriction of Hazardous Substances
RPM (Revolutions Per Minute
RPM (Rotations Per Minute
RPN (Risk Priority Number
RSSI (Received Signal Strength Indicator
RTC (Real Time Clock
RTF (Rich Text Format
RTOS (Real-Time Operating System


S (Severit
S2E (Serial-to-Ethernet
SAE (Society for Automotive Engineers
SATA (Serial ATA
SAW (Surface Acustic Wave filter
SBAS (Satellite Based Augmentation System
SBC (System Basis Chip
SC (Smart Card
SCL (System Control Layer
SCTE Society of Cable Telecommunications Engineer
SD (Secure Digital
SD (Standard definition
SDRAM (Synchronous Dynamic Random-Access Memory
SDT (Schematic Design Tools
SDTV (Standard Definition Television
SECAM (Séquentiel Couleur Avec Mémoire (French Color TV Standard)
SenML (Sensor Markup Language
SFPS (Early identification of single failure points
SFS (Streaming File System
SG (Safety Goal
SIM (Subscriber Identification Module
SIP (Single-In-Line Package
SMSC (Standard Microsystems Corporation
SMT (Surface mount technology
SnPb (Tin-Lead -for solder
SoC (System on Chip
SOD (Small Outline Diode
SODFL (Small Outline Diode Flat Lead
SOIC (Small Outline Integrated Circuit
SOJ (Small Outline IC J-Leaded
SON (Small Outline No-lead
SOP (Small Outline Package
SOTFL (Small Outline Transistor Flat Lead
SPFM (Single Point Fault Metric
SPI (Serial Peripheral Interface
SQFP (Shrink Quad Flat Packages
SRDY (Slave Ready
SRO (Solder resistant opening
SSOP (Shrink Small Outline Package
SSR (Solid State Relay
SSS (Selective Solder Strip
SSTL (Stub Series Terminated Logic
STB (Set Top Box


TBD (To Be Determined
TCP (Transmission Control Protocol
TCP/IP (Transmission Control Protocol/Internet Protocol
TCXO (Temperature-Compensated Crystal Oscillator
TDES (Triple Data Encryption Standard
TI (Texas Instruments
TP (Test Point
TQFP (Thin Quad Flat Package
TRNG (True Random Number Generator
TS (Transport Stream
TSC (Technical Safety Concept
TSOP (Thin Small Outline Package
TSQFP (Thin Shrink Quad Flat Packages
TSSOP (Thin Shrink Small Outline Package
TTFF (Time to First Fix
TTSC (Telit Technical Support Centre


UART (Universal Asynchronous Receiver/Transmitter
ULPI (Utmi+ Low Pin Interface
UMTS (Universal Mobile Telecommunication System
UPnP (Universal Plug and Play
USB (Universal Serial Bus


V2X (Vehicle to Everything
VBATT (Battery Power Supply
VGA (Video Graphics Array
VNA (Vector Network Analyzer
VSWR (Voltage Standing Wave Ratio


WAAS (Wide Area Augmentation System
WAN (Wide Area Networks
WCDMA (Wideband Code Division Multiple Access
Wi-Fi (Wireless Internet Free Internet
WLAN (Wireless Local Area Network
WLPSP Wafer Level Pico Scale Package
WPS (Wi-Fi Protected Setup
WSI (WLAN to Serial interface


xSP (Hosted Service Provider
XTAL (Crystal


Z (Impedance
ZIF (Zero Insertion Force